2012Engineering Specification Quali

2012Engineering Specification

Quality/Reliability Tests
Specification for IBM Systems & Technology Group
Rigid Printed Circuit Boards


Technical Jeffrey A. Taylor
Owner:
IBM Corporation
Rochester, MN
Dept FM2/040-2
[phone]
Tie Line: 553-2475
[e-mail]
Technical John T. Wilson
Approval:
IBM Corporation
Endicott, NY
Dept FM2/040-2
[phone]
Tie Line: 620-3044
[e-mail]

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PN 53P4943
Page 1 of 38
EC H63475
07OCT02
EC H63972
15MAY03
EC H64116
26JUN03
EC H86078
07SEP04
EC H87040
31JAN06
EC L37794
26MAR12

This document is the property of IBM. Its use is authorized only for responding to a request for quotation or for the
performance of work for IBM. All questions must be referred to the IBM Purchasing Department.


2011Engineering Specification

Contents

1.0 Introduction ......................................................................................................... 5


1.1 Scope................................................................................................................................... 5


1.2 Deviations ............................................................................................................................ 5


1.3 Precedence ........................................................................................................................... 5


1.4 References........................................................................................................................... 6


1.4.1 IBM Specifications.................................................................................................. 6


1.4.2 Industry Standards.................................................................................................. 6


1.5 Safety .................................................................................................................................. 6


2.0 General Criteria ................................................................................................... 7


2.1 Product Qualification........................................................................................................... 7


2.1.1 Applicable Tests...................................................................................................... 7


2.1.2 Special Tests............................................................................................................ 7


2.1.3 Assembly Tests ........................................................................................................ 7


2.2 Product Monitoring.............................................................................................................. 7


2.3 Ambient Conditions For Measurement................................................................................ 7


3.0 Test Procedures .................................................................................................. 8


3.1 Visual .................................................................................................................................. 8


3.1.1 Microsectioning, Manual Method........................................................................... 8


3.1.1.1 Test Specimen.......................................................................................................... 8


3.1.1.2 Equipment/Materials............................................................................................... 8


3.1.1.3 Procedure................................................................................................................ 9


3.1.1.3.1 Preparation of Potting Material ....................................................................... 9


3.1.1.3.2 Preparation of Mount ....................................................................................... 9


3.1.1.3.3 Grinding and Polishing..................................................................................... 9


3.1.1.3.4 Evaluation Criteria ......................................................................................... 10


3.1.2 Microsectioning, Automatic Method..................................................................... 10


3.2 Chemical ............................................................................................................................ 11


3.2.1 Ionic Cleanliness

結果 (中文) 1:

2012Engineering 规范质量的可靠性测试IBM 系统与技术组规范刚性印制电路板技术 Jeffrey A.泰勒所有者︰IBM 公司明尼苏达州罗切斯特部 FM2/040-2(507) 253-2475联络线︰ [e-mail]技术的约翰 · 威尔逊批准︰IBM 公司纽约州恩迪科特部 FM2/040-2(607) 429-3044联络线︰ [e-mail]注意︰ 本文档在最新的电子商务水平不可能和必须及时从何时使用下夷为平地。此文档的主副本是保留在企业中的在线控制的版本存储库环境 (ERE)。所有的硬拷贝复制品都非控制。IBM 供应商应该找到最新的副本，通过 IBM¡¯s 电喷净的 web 站点。本文档是 IBM 的属性。仅为响应请求授权其使用报价或性能的 IBM 工作。所有问题必须都提到 IBM采购部。PN 53 P 4943页 1 的 38EC H6347507 OCT 02EC H6397215 5 月 03EC H6411626 JUN 03EC H8607807 SEP 04EC H8704031 01 月 06 日EC L3779426 3 月 12 日本文档是 IBM 的属性。仅为响应请求报价或授权其使用IBM 的工作性能。所有问题必须都提到 IBM 采购部。 2011Engineering 规范内容1.0 Introduction .........................................................................................................51.1 Scope...................................................................................................................................51.2 Deviations ............................................................................................................................51.3 Precedence ...........................................................................................................................51.4 References...........................................................................................................................61.4.1 IBM Specifications..................................................................................................61.4.2 Industry Standards..................................................................................................61.5 Safety ..................................................................................................................................62.0 General Criteria ...................................................................................................72.1 Product Qualification...........................................................................................................72.1.1 Applicable Tests......................................................................................................72.1.2 Special Tests............................................................................................................72.1.3 Assembly Tests ........................................................................................................72.2 Product Monitoring..............................................................................................................72.3 环境条件测量...73.0 Test Procedures ..................................................................................................83.1 Visual ..................................................................................................................................83.1.1 微切片，手动方法...83.1.1.1 Test Specimen..........................................................................................................83.1.1.2 Equipment/Materials...............................................................................................83.1.1.3 Procedure................................................................................................................93.1.1.3.1 的灌封料的制备......93.1.1.3.2 Preparation of Mount .......................................................................................93.1.1.3.3 研磨和抛光...93.1.1.3.4 Evaluation Criteria .........................................................................................103.1.2 微切片，自动方法...103.2 Chemical ............................................................................................................................113.2.1 离子洁净度

結果 (中文) 3:

2012engineering规范质量/可靠性试验IBM系统和技术集团规范刚性印刷电路板技术Jeffrey A. Taylor业主：IBM公司罗切斯特，MN部门/ 040-2 FM2（507）253-2475联络线：[e-mail] T. Wilson技术验收：IBM公司Endicott，NY部门/ 040-2 FM2（607）429-3044联络线：[e-mail]注意：本文件可能不在最新的电子商务水平，并必须及时删除向下使用时。本文档的主副本是在企业中维护的在线控制版本库环境（ERE）。所有的硬拷贝的复制品是非控制。IBM的供应商应该通过IBM的¡¯EGI网网站找到最新的副本。本文档是IBM的财产。它的使用被授权只为响应一个请求报价或工作表现为IBM。所有的问题都必须提交给IBM采购部。PN 53p4943第1 / 38页电子商务h6347507oct02电子商务h6397215may03电子商务h6411626jun03电子商务h8607807sep04电子商务h8704031jan06电子商务l3779426mar12本文档是IBM的财产。它的使用被授权只为响应报价的请求或为IBM的工作性能。所有的问题都必须提交给IBM采购部。2011engineering规范内容1引言.........................................................................................................五1.1范围...................................................................................................................................五1.2 ............................................................................................................................偏差五1.3优先...........................................................................................................................五1.4参考文献...........................................................................................................................六1.4.1 IBM规格..................................................................................................六1.4.2行业标准..................................................................................................六1.5安全..................................................................................................................................六2一般标准...................................................................................................七2.1产品合格...........................................................................................................七2.1.1适用的测试......................................................................................................七2.1.2特殊试验............................................................................................................七2.1.3装配试验........................................................................................................七2.2产品的监视..............................................................................................................七测量................................................................................ 2.3环境条件七3测试程序..................................................................................................八3.1视觉..................................................................................................................................八3.1.1类手工方法...........................................................................八3.1.1.1试样..........................................................................................................八3.1.1.2设备/材料...............................................................................................八3.1.1.3程序................................................................................................................九3.1.1.3.1 .......................................................................灌封材料的制备九3.1.1.3.2 Mount .......................................................................................制备九3.1.1.3.3研磨和抛光.....................................................................................九3.1.1.3.4评价标准.........................................................................................十3.1.2类.....................................................................自动方法十3.2化学............................................................................................................................十一3.2.1离子清洁度