防焊曝光時,底片偏移或底片與板子之間有漲縮(尺寸)差異造成防焊偏。

防焊曝光時,底片偏移或底片與板子之間有漲縮(尺寸)差異造成防焊偏。

結果 (英文) 1:

When the solder resist exposure, sizing or backsheet offset (dimension) caused by differences between the backsheet and the solder partial board.

結果 (英文) 2:

When the anti-weld exposure, the negative offset or the difference between the negative and the plate increase and shrink (size) causes the anti-weld bias.

結果 (英文) 3:

During the exposure of anti welding, the offset of the negative film or the difference of the expansion (size) between the negative film and the board results in the deviation of anti welding.