[0038] The microstructures MS1 may be formed by the patterning process for forming the 取向層 118A. For example, the material layer for the 底層 116A and the material layer for the 取向層 118A may be formed on the support plate 112A in sequence. The method of forming the material layer for the 底層 116A and the material layer for the 取向層 118A may include deposition, coating, printing or the like. For example, the method of forming the material layer for the 取向層 118A may be spin coating. In some embodiments, the 取向層 118A formed by using spin coating may have a flattened top surface facing away from the support plate 112A.