Qualification Reflow: The MPU-6500

Qualification Reflow: The MPU-6500 was qualified in accordance with IPC/JEDEC J-STD-020D.1. This
standard classifies proper packaging, storage and handling in order to avoid subsequent thermal and
mechanical damage during the solder reflow attachment phase of PCB assembly.
The qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak
cycle (in a temperature humidity oven), and three consecutive solder reflow cycles, followed by functional
device testing.

結果 (中文) 3:

资格合格的回流：mpu-6500按照IPC / JEDEC j-std-020d 1。这个标准分类
适当的包装，储存和处理为了避免随后的热回流焊接阶段
PCB装配过程中的机械损伤。
资格预处理过程指定一个由烘烤周期序列，水分浸泡
周期（在一个温度湿度炉），和三个连续的焊料回流周期，其次是功能
装置测试。