如討論。對於擴散議題，我們規劃兩種條件的電鍍試運行製程，如下：條件1：

如討論。對於擴散議題，我們規劃兩種條件的電鍍試運行製程，如下：
條件1：
介電層：oxide thk=1.5um
種子層：Ti/Cu thk=0.1/0.2um
電鍍層：Ti/Ni/Au thk=2/2/0.3um
Qty=1pc

條件2：
介電層：oxide + SiNx thk=1.5um + 0.5um
種子層：Ti/Cu thk=0.1/0.2um
電鍍層：Ti/Ni/Au thk=2/2/0.3um
Qty=1pc

如果這試運行確認進行，這將會增加約2週的工作天。再請您確認?

結果 (英文) 1:

As will be discussed. For diffusion issues, we planned commissioning two conditions electroplating process, as follows:
Condition 1:
dielectric layer: oxide thk = 1.5um
seed layer: Ti / Cu thk = 0.1 / 0.2um
plating layers: Ti / Ni / Au thk 2 = / 2 / 0.3um
Qty = 1pc

condition 2:
dielectric layer: oxide + SiNx thk = 1.5um + 0.5um
seed layer: Ti / Cu thk = 0.1 / 0.2um
plating layers: Ti / Ni / Au thk = 2 /2/0.3um
Qty = 1pc

If confirm this test run, which will increase the days for about 2 weeks. And then you confirm?

結果 (英文) 2:

Such as discussion.
For diffusion issues, we plan a trial run of plating for two conditions, as follows:
Condition 1:
Dielectric layer: thk oxide s 1.5um
Seed layer: Ti/Cu thk s 0.1/0.2um
Plating: Ti/Ni/Au thk s 2/2/0.3um

Qty-1pc
Condition 2:
Dielectric layer: soxide SiNx thk s.5um s.5um
Seed layer: Ti/Cu thk s 0.1/0.2um
Plating: Ti/Ni/Au thk s 2/2/0.3um

Qty-1pc If this commissioning is confirmed, this will add about 2 weeks of working days. Would you please confirm again?

結果 (英文) 3:

As discussed. For the diffusion issue, we plan two conditions of plating trial run process, as follows:
Condition 1:
Dielectric layer: oxide THK = 1.5um
Seed layer: Ti / Cu THK = 0.1/0.2um
Electroplated layer: Ti / Ni / Au THK = 2 / 2 / 0.3um
Qty=1pc
Condition 2:
Dielectric layer: oxide + SiNx THK = 1.5um + 0.5um
Seed layer: Ti / Cu THK = 0.1/0.2um
Electroplated layer: Ti / Ni / Au THK = 2 / 2 / 0.3um
Qty=1pc
If this commissioning is confirmed, it will increase the working days by about 2 weeks. Please confirm again?