1﹒ □內層製作 □內層1350機台製作 □BGA外層線路製作 2﹒

1﹒ □內層製作 □內層1350機台製作 □BGA外層線路製作

2﹒ □ L2線寬 MIN72 um，L2線距 40±15 um，Ring邊90um
□ L2線寬 MIN75 um，L2線距 40±15 um，Ring邊90um

3﹒ □ L3線寬 MIN75 um，L3線距 40±20 um，Ring邊90um
□ L3線寬 MIN75 um，L3線距 40±15 um，Ring邊90um

4﹒ □ X軸放大率 100.090 □ X軸放大率 100.100
Y軸放大率 100.070 Y軸放大率 100.060

5﹒ 特殊要求 □無 □有 1.內層銅厚18±5um 2.指定LDI機台製作

結果 (英文) 1:

1.1350-layer-Layer machine making-BGA outer line card 2.-the L2 line width MIN72 um,L2 from 40 ± 15 um,Ring side 90um -L2 line width MIN75 um,L2 from 40 ± 15 um,Ring side 90um 3.-L3 line width MIN75 um,L3 from 40 ± 20 um,Ring side 90um -L3 line width MIN75 um,L3 from 40 ± 15 um,Ring side 90um 4.-x 100.090-x magnification magnification 100.100 Magnification magnification 100.070 y axis y axis 100.060 5. Special requirements-none-1. inner layer copper thickness 18 5um 2. designated LDI machines production

結果 (英文) 3:

18 of axis Y axis X, away from the line, line edge distance, line width, distance, linewidth] edge distance, linewidth, BGA 1350 the inner lining of the 1 -]] machine] outer line

2] L2 MIN72 um L2 40 + 15 um, ring was 90um
L2 MIN75 um L2 40 + 15 um, ring edge 90um

3] L3 MIN75 um L3 40 + 20 um, ring was 90um
] L3 MIN75 um L3 40 + 15 um, ring edge 90um

4] x magnification 100.090] magnification 100.100
y magnification 100.070 magnification 100.060

5 - special requirements]]. The inner copper thickness + 5um.Specify the LDI machine to make