In general can the mold tooling be shared between exposed pad and non exposed pad packages? For example can the mold tool for the 48L 7x7x1mm TQFP be
shared with the 48L 7x7x1mm TQFP_EP package?
-> there will have EP resin bleeding concern, so base on mold tooling design.
by one eject pin design, suggest application for non-EP type only. if use for EP type will have resin bleeding concern on EP side.
by two eject pin design, can to combine with EP and non-EP type.(but POD concern)