潛在失效模式干膜浮離銅面殘留異物板面刮傷卡板銅面氧化及異物板面滾輪印或

潛在失效模式

干膜浮離

銅面殘留異物
板面刮傷
卡板


銅面氧化及異物
板面滾輪印或刮傷

銅面氧化及異物


铜面氧化及異物

銅面氧化及異物
铜面氧化及異物




銅面殘留金剛砂或異物
銅面殘留金剛砂或異物


銅面殘留金剛砂或異物
銅面殘留金剛砂或異物
銅面殘留金剛砂或異物
銅面殘留金剛砂或異物
銅面氧化
銅面氧化殘留異物






板面殘留清潔劑藥液


板面異物殘留


"1.銅面氧化；
2.銅面粗化不夠；"







孔/面銅厚度不足


板面異物殘留

銅面氧化


板面異物殘留

"1.活化槽酸度過低
2.銅面氧化"


基材或防焊面鍍上鈀

銅面未鍍上鈀層







板面異物殘留

基材殘留鈀層
銅面鈀層被洗掉

板面異物殘留

鎳磷合金沉積過快






鎳磷合金沉積過快


鎳槽析鎳

鎳磷合金沉積過慢




鎳磷合金沉積不良/黑鎳
板面未鍍上鎳層
鎳面異物吸附

金沉積速度過慢



"金沉積過快

"



金沉积不佳


"金面水纹

"

板面残留水纹


"板面残留水纹

"



受镀面清洁不净
药水交换不佳
線速過快
板面滾輪印及刮傷

板面清潔不凈

板面清潔不凈

板面清潔不凈
板面清潔不凈

板面清潔不凈

板面清潔不凈

離子污染度不達標
板面未烘干
去膜不凈


去膜不凈或銅面氧化或防焊面啞色



去膜不凈或銅面氧化
板面滾輪印及刮傷
去膜不凈或銅面氧化




板面清潔不凈



板面清潔不凈



板面清潔不凈
板面清潔不凈



板面清潔不凈




去膜不凈/銅面氧化



去膜不凈/銅面氧化


板面未烘干
去膜后板面不清潔

結果 (中文) 1:

潜在失效模式干膜浮离铜面残留异物板面刮伤卡板铜面氧化及异物板面滚轮印或刮伤铜面氧化及异物铜面氧化及异物 铜面氧化及异物铜面氧化及异物铜面残留金刚砂或异物铜面残留金刚砂或异物铜面残留金刚砂或异物铜面残留金刚砂或异物铜面残留金刚砂或异物铜面残留金刚砂或异物铜面氧化铜面氧化残留异物板面残留清洁剂药液板面异物残留"1.铜面氧化；2.铜面粗化不够；"孔/面铜厚度不足板面异物残留铜面氧化板面异物残留"1.活化槽酸度过低2.铜面氧化"基材或防焊面镀上钯铜面未镀上钯层板面异物残留基材残留钯层铜面钯层被洗掉板面异物残留镍磷合金沉积过快镍磷合金沉积过快镍槽析镍镍磷合金沉积过慢镍磷合金沉积不良/黑镍板面未镀上镍层镍面异物吸附金沉积速度过慢"金沉积过快"金沉积不佳"金面水纹"板面残留水纹"板面残留水纹"受镀面清洁不净药水交换不佳线速过快板面滚轮印及刮伤板面清洁不凈板面清洁不凈板面清洁不凈板面清洁不凈板面清洁不凈板面清洁不凈离子污染度不达标板面未烘干去膜不凈去膜不凈或铜面氧化或防焊面哑色去膜不凈或铜面氧化板面滚轮印及刮伤去膜不凈或铜面氧化板面清洁不凈板面清洁不凈板面清潔不凈板面清潔不凈板面清潔不凈去膜不凈/銅面氧化去膜不凈/銅面氧化板面未烘干去膜后板面不清潔

結果 (中文) 3:

Potential failure mode
Dry film floating off
Residual foreign body in copper surface
Scratch the surface
Card
Oxidation of copper surface and foreign matter
Board roller printing or scratch
Oxidation of copper surface and foreign matter
Oxidation of copper surface and foreign matter
Oxidation of copper surface and foreign matter
Oxidation of copper surface and foreign matter
Residual diamond sand or foreign matter in copper surface
Residual diamond sand or foreign matter in copper surface
Residual diamond sand or foreign matter in copper surface
Residual diamond sand or foreign matter in copper surface
Residual diamond sand or foreign matter in copper surface
Residual diamond sand or foreign matter in copper surface
Oxidation of copper surface
Residual foreign body of copper oxide
The surface residual liquid detergent
The surface residual foreign body
1 oxidation of copper surface;
2 copper surface coarsening is not enough;"
Hole / surface copper thickness
The surface residual foreign body
Oxidation of copper surface
The surface residual foreign body
"1 activation trough acidity is too low
2 oxidation of copper surface"
Substrate or solder plating on palladium
Copper surface is not plated on the palladium layer
The surface residual foreign body
Residual palladium layer
Copper palladium layer is washed off
The surface residual foreign body
Ni P alloy deposits too fast
Ni P alloy deposits too fast
Nickel bath analysis
Nickel phosphorus alloy deposits too slow
Nickel phosphorus alloy deposition bad / Black Nickel
The board is not on a nickel plated layer
Nickel surface foreign body adsorption
Gold deposition rate is too slow
"Gold deposits too fast.
"
Gold deposit is not good
"Water side
"
The surface residual water
The surface residual water
"
Plated surface clean
Water exchange is not good
Line speed too fast
Board roller printing and scratch
Clean dirty
Clean dirty
Clean dirty
Clean dirty
Clean dirty
Clean dirty
Ionic contamination degree is not up to the standard
The board is not drying
Go to the film is not clean
Go to the film is not clear or copper surface oxidation or anti welding face matte
Membrane removal or oxidation of copper surface
Board roller printing and scratch
Membrane removal or oxidation of copper surface
Clean dirty
Clean dirty
Clean dirty
Clean dirty
Clean dirty
Membrane removal / oxidation of copper surface
Membrane removal / oxidation of copper surface
The board is not drying
Go to the film after the surface is not clean