Connections formed to leads positioned perpendicular to a circuit land in a butt configuration must meet dimensional and solderfillet requirements in Table 8-8. Post assembly acceptability evaluations should consider the inherent limitation of this componentmounting technique to survive operational environments when compared to footed leads or through hole mounting.For Class 1 and 2 product, leads not having wettable sides by design (such as leads stamped or sheared from preplated stock)are not required to have side fillets. However the design should permit easy inspection of wetting to the wettable surfaces.Butt joints are not permitted for Class 3 products.