In addition, the results for the ba

In addition, the results for the bare FBG and MCFBG sensors shown in Fig. 5(a) (where the sensors were embedded in cross-plylaminates) and Fig. 5(b) (where the sensors were embedded in quasi-isotropic-ply laminates) indicate a tendency toward graduallyincreasing intensity after approximately 70℃. Therefore, it is estimated that 70℃ may be the temperature for gelation. Moreover, theresults indicated that, at around 70℃, the intensity variable of the quasi-isotropic-ply laminates, as shown in Fig. 5(b), was biggerthan that of the cross-ply laminates, as shown in Fig. 5(a).After curing was completed, the temperature decreased. Based on the spectral variation trend during the temperature decline inthe curing process, shown in Fig. 6, the shift trend in the overall spectra of the temperature-decrease process was stable. However, thespectra have demonstrated a clear trend of broadening. In the cooling to room temperature process, spectra widened considerably.Therefore, we can deduce that all laminated sensors are affected by axial and lateral stresses. Further, the residual stress during thecooling process is generated by the outermost layer.

結果 (繁體中文) 1:

In addition, the results for the bare FBG and MCFBG sensors shown in Fig. 5(a) (where the sensors were embedded in cross-ply
laminates) and Fig. 5(b) (where the sensors were embedded in quasi-isotropic-ply laminates) indicate a tendency toward gradually
increasing intensity after approximately 70℃. Therefore, it is estimated that 70℃ may be the temperature for gelation. Moreover, the
results indicated that, at around 70℃, the intensity variable of the quasi-isotropic-ply laminates, as shown in Fig. 5(b), was bigger
than that of the cross-ply laminates, as shown in Fig. 5(a).
After curing was completed, the temperature decreased. Based on the spectral variation trend during the temperature decline in
固化過程中，在圖6中所示，在溫度降低過程的總光譜的移位的趨勢是穩定的。然而，
光譜表明擴大的明顯趨勢。在冷卻至室溫過程中，顯著的光譜加寬。
因此，我們可以推斷，所有層疊傳感器由軸向和橫向應力的影響。另外，在期間的殘餘應力
是由最外層產生的冷卻過程。

結果 (繁體中文) 2:

此外，圖 5（a）所示的裸FBG和MCFBG感應器（感應器嵌入在跨板中）的結果
層壓板）和圖5（b）（感應器嵌入在准各向異性層壓板中）表明，其趨勢是逐漸
在大約 70°C 後增加強度。因此，估計70°C可能是凝膠化的溫度。此外，
結果表明，在70°C左右，如圖5（b）所示，准各向異性層壓層的強度變數較大
比跨層壓層，如圖5（a）所示。
固化完成後，溫度降低。基於溫度下降期間的光譜變化趨勢
如圖6所示的固化過程，在溫度降低過程整體光譜中的偏移趨勢是穩定的。但是，
光譜已顯示出明顯的擴大趨勢。在冷卻到室溫的過程中，光譜大大拓寬。
因此，我們可以推斷出所有層壓感應器都受到軸向應力和橫向應力的影響。此外，在
冷卻過程由最外層生成。

結果 (繁體中文) 3:

此外，圖5（a）所示的裸FBG和MCFBG感測器的結果（其中感測器嵌入交叉層中
層合板）和圖5（b）（感測器嵌入在准各向同性層合板中）表明逐漸趨向於
約70℃後强度新增。囙此，估計70℃可能是凝膠化的溫度。而且
結果表明，在70℃左右，准各向同性層合板的强度變化較大，如圖5（b）所示
如圖5（a）所示。
固化完成後，溫度降低。根據年氣溫下降期間的光譜變化趨勢
固化過程，如圖6所示，溫度降低過程的整體光譜的變化趨勢是穩定的。然而
光譜顯示出明顯的展寬趨勢。在冷卻至室溫過程中，光譜明顯變寬。
囙此，我們可以推斷所有層合感測器都受到軸向和橫向應力的影響。此外，在
冷卻過程由最外層產生。