The chip is the major loss which is over tightening the appearance specification by manufacture dept., the chip is allowing and meet the spec. requirement after the engineer dept. confirmed.Meanwhile, the next new grind sheet will follow up these criteria of the appearance inspection and will not overkill again. (completed the appearance inspection training.)The second one is wafer broken loss, we’ve found the thin wafer like final thickness 184±2um which has higher warp around 500~600um and very difficult on packing these high warp wafers with shipping box. Our engineer has tried to close the shipping box but make wafer broken during the box closed. So we’re wondering to have a cylinder container (horizontal type) to packing the thinner and high warp wafer in the future, IXYS suggests us to use the same box and do some adjustment when wafer packing.(as below) Please ship the DXA wafer in the boxes in which the wafers have arrived. Sissis gave me the input that such wafers should be transported one end of the flat being orientated upward i.e. rotated by ca. 20° from center of flat looking upward.