Philips Lumileds: Chip Scale Packag

Philips Lumileds: Chip Scale Packaging for LEDs
PhD. Bhardwaj Jyoti, Senior Vice President, R&D, Philips Lumileds gives detailed information about the development of chip scale package technology in this article. Chip scale packages are novel to the LED industry but they are the mainstay of the semiconductor industry. Development of CSP in the Si ICs was driven by miniaturization, improved thermals, higher reliability, and simply the need to connect to an ever increasing pin-count on an ever shrinking die. Chip Scale packages also enabled a reduction in device parasitic and allowed for ease of integration into Level 2 packaging. It is therefore a natural evolution for such packaging innovation to proliferate into other industries including the LED product space and therefore not surprising that Chip-scale packaging has made inroads into the LED industry recently released by Philips Lumileds. Other LED manufacturers also claim to be working on such LED device packages.

結果 (中文) 1:

飞利浦 Lumileds: 芯片尺寸封装的指示灯巴德瓦杰博士 Jyoti、 高级副总裁、 研发、 飞利浦 Lumileds 详细介绍关于芯片规模封装技术的发展在这篇文章。芯片规模封装对 LED 行业的小说但他们是半导体工业的支柱。在半导体集成电路 CSP 的发展受到了小型化、 改进的热量、 可靠性更高，只需要连接到不断增加引脚数量不断萎缩的模具。芯片规模封装也能够减少所需设备寄生和允许为方便的集成到级别 2 包装。因此是这种包装创新扩散到其他行业，包括 LED 产品空间自然的进化过程并因此不令人惊讶那芯片规模封装了最近公布的飞利浦 Lumileds 的 LED 产业进军。其他 LED 制造商还声称要对这种 LED 器件封装工作。

結果 (中文) 3:

飞利浦Lumileds：LED芯片规模封装博士。Bhardwaj Jyoti，高级副总裁，研发，飞利浦Lumileds公司在这篇文章中给出了芯片级封装技术的发展的详细信息。芯片规模封装是新的主导产业，但它们是半导体产业的支柱。在硅芯片CSP开发驱动的小型化，提高散热，可靠性更高，只需要连接到一个不断缩小的芯片引脚上。芯片级封装也使设备的寄生减少，并允许为便于集成到2级封装。因此，对于这样的包装创新扩散到其他行业包括LED产品的空间，因此毫不奇怪，芯片规模封装已大举进入LED行业的飞利浦Lumileds公司最近发布了一个自然进化。其他发光二极管制造商也声称要在这样的发光器件封装工作。