潛在失效模式干膜浮離銅面殘留異物板面刮傷卡板銅面氧化及異物板面滾輪印或

潛在失效模式

干膜浮離

銅面殘留異物
板面刮傷
卡板


銅面氧化及異物
板面滾輪印或刮傷

銅面氧化及異物


铜面氧化及異物

銅面氧化及異物
铜面氧化及異物




銅面殘留金剛砂或異物
銅面殘留金剛砂或異物


銅面殘留金剛砂或異物
銅面殘留金剛砂或異物
銅面殘留金剛砂或異物
銅面殘留金剛砂或異物
銅面氧化
銅面氧化殘留異物






板面殘留清潔劑藥液


板面異物殘留


"1.銅面氧化；
2.銅面粗化不夠；"







孔/面銅厚度不足


板面異物殘留

銅面氧化


板面異物殘留

"1.活化槽酸度過低
2.銅面氧化"


基材或防焊面鍍上鈀

銅面未鍍上鈀層







板面異物殘留

基材殘留鈀層
銅面鈀層被洗掉

板面異物殘留

鎳磷合金沉積過快






鎳磷合金沉積過快


鎳槽析鎳

鎳磷合金沉積過慢




鎳磷合金沉積不良/黑鎳
板面未鍍上鎳層
鎳面異物吸附

金沉積速度過慢



"金沉積過快

"



金沉积不佳


"金面水纹

"

板面残留水纹


"板面残留水纹

"



受镀面清洁不净
药水交换不佳
線速過快
板面滾輪印及刮傷

板面清潔不凈

板面清潔不凈

板面清潔不凈
板面清潔不凈

板面清潔不凈

板面清潔不凈

離子污染度不達標
板面未烘干
去膜不凈


去膜不凈或銅面氧化或防焊面啞色



去膜不凈或銅面氧化
板面滾輪印及刮傷
去膜不凈或銅面氧化




板面清潔不凈



板面清潔不凈



板面清潔不凈
板面清潔不凈



板面清潔不凈




去膜不凈/銅面氧化



去膜不凈/銅面氧化


板面未烘干
去膜后板面不清潔

結果 (英文) 1:

Potential failure modesDry floatCopper residual foreign bodySurface scratchesCard BoardOxidation of copper surface and foreign bodiesWheel seal, or of the plate surface scratchesOxidation of copper surface and foreign bodiesOxidation of copper surface and foreign bodies Oxidation of copper surface and foreign bodiesOxidation of copper surface and foreign bodiesEmery copper residue or foreign bodyEmery copper residue or foreign bodyEmery copper residue or foreign bodyEmery copper residue or foreign bodyEmery copper residue or foreign bodyEmery copper residue or foreign bodyOxidation of copper surfaceOxidation of copper surface residual foreign bodySurface residue cleaning agent liquidResidual foreign body"1. oxidation of copper surface;2. copper surface roughening is not enough; "Insufficient hole/surface copper thicknessResidual foreign bodyOxidation of copper surfaceResidual foreign body"1. the acidity of activation tank too low2. oxidation of copper surface "Or solder surface of base material coated with PalladiumNot Palladium plated copper layerResidual foreign bodyResidual Palladium substrate layerCopper Palladium surface layer is washed awayResidual foreign bodyNI-p alloy depositionNI-p alloy depositionNickel nickel slots on theNI-p alloy deposition too slowNI-p alloy deposit bad nickel/blackSurface is not coated with nickelNickel adsorption foreign bodyGold too slow"Gold fast"Poor gold deposit"Golden wave"Surface residual water"Surface residual water"Plated surfaces clean, dirtyPoor solution ExchangeWire speed too fastRoller printing plate surface and scratchesPlate surface without netPlate surface without netPlate surface without netPlate surface without netPlate surface without netPlate surface without netIonic contamination level standardsPanel not dryingTo film the netNET or oxidation of copper surface or membrane does not solder side matte colorsNET or not to film oxidation of copper surfaceRoller printing plate surface and scratchesNET or not to film oxidation of copper surfacePlate surface without netPlate surface without netPlate surface clear 潔 not netPlate surface clear 潔 not netPlate surface clear 潔 not netNET/銅 film surface oxidationNET/銅 film surface oxidationPanel not dryingFilm Board clearly 潔

結果 (英文) 3:

Potential failure mode
Dry film floating off
Residual foreign body in copper surface
Scratch the surface
Card
Oxidation of copper surface and foreign matter
Board roller printing or scratch
Oxidation of copper surface and foreign matter
Oxidation of copper surface and foreign matter
Oxidation of copper surface and foreign matter
Oxidation of copper surface and foreign matter
Residual diamond sand or foreign matter in copper surface
Residual diamond sand or foreign matter in copper surface
Residual diamond sand or foreign matter in copper surface
Residual diamond sand or foreign matter in copper surface
Residual diamond sand or foreign matter in copper surface
Residual diamond sand or foreign matter in copper surface
Oxidation of copper surface
Residual foreign body of copper oxide
The surface residual liquid detergent
The surface residual foreign body
1 oxidation of copper surface;
2 copper surface coarsening is not enough;"
Hole / surface copper thickness
The surface residual foreign body
Oxidation of copper surface
The surface residual foreign body
"1 activation trough acidity is too low
2 oxidation of copper surface"
Substrate or solder plating on palladium
Copper surface is not plated on the palladium layer
The surface residual foreign body
Residual palladium layer
Copper palladium layer is washed off
The surface residual foreign body
Ni P alloy deposits too fast
Ni P alloy deposits too fast
Nickel bath analysis
Nickel phosphorus alloy deposits too slow
Nickel phosphorus alloy deposition bad / Black Nickel
The board is not on a nickel plated layer
Nickel surface foreign body adsorption
Gold deposition rate is too slow
"Gold deposits too fast.
"
Gold deposit is not good
"Water side
"
The surface residual water
The surface residual water
"
Plated surface clean
Water exchange is not good
Line speed too fast
Board roller printing and scratch
Clean dirty
Clean dirty
Clean dirty
Clean dirty
Clean dirty
Clean dirty
Ionic contamination degree is not up to the standard
The board is not drying
Go to the film is not clean
Go to the film is not clear or copper surface oxidation or anti welding face matte
Membrane removal or oxidation of copper surface
Board roller printing and scratch
Membrane removal or oxidation of copper surface
Clean dirty
Clean dirty
Clean dirty
Clean dirty
Clean dirty
Membrane removal / oxidation of copper surface
Membrane removal / oxidation of copper surface
The board is not drying
Go to the film after the surface is not clean