This is a new design for ASECL to review and propose a package solution. It’s a 9 die Isolator
package.
ADI would prefer to achieve a package design using standard leadframe technology. As a second
option, they could consider using an Etch-Back leadframe solution. As a 3rd option, they have also
considered the possibility of using a laminate substrate, however as the target application is a
Power management, a laminate substrate would need to meet the thermal requirements to
operate properly. They would be open to ASECL’s suggestions and recommendations.
The target package body size is “as small as possible” but I believe they can accept up to 9x7mm.
The external metal clearance requirement is 2.1mm (min).
We would like ASECL to review this bond diagram and provide a proposal to meet your MP
capabilities. As noted above, the 1st preference is leadframe based QFN.
Let me know if you have any initial questions/concerns. We can start with a preliminary, first pass
ASECL design for ADI review and then modify from there….