For the first time, the condensation test must be performed prior tothe final specification of the circuit layout (hardware freeze), butalready with assemblies manufactured under conditions similar toproduction, to optimize detected condensation sensitivities, e.g.,by means of layout and circuit modifications.If the manufacturing process of the assembly is changed (e.g.,circuit carrier, solder, flux, soldering process, layout, location, orparts), the test must be repeated.