關於新增的穿孔評估：1. 我們本地有供應商可以進行研磨的製程。請問您所

關於新增的穿孔評估：1. 我們本地有供應商可以進行研磨的製程。請問您所指的熱敏膠帶的用途是什麼?2. 為了降低晶圓處罝上的風險，我們建議製程先進行through via的蝕刻，再進行薄化處理。3. 我們目前對填充通孔的經驗較少，這可能還需要評估其它可以合作的資源。(IME是否有這項製製程能力呢?)如果可以的話，請您先提供製程流程圖，我們再安排會議討論。

結果 (英文) 1:

The new assessment of perforation:
1. We have local suppliers may be grinding process. May I ask what you mean by thermal tape used for?
2. In order to reduce the risk on the wafer at catching rabbits, we recommend the process to etch through via, and then thinning.
3. We currently experience filled vias less, which may also need to evaluate other resources cooperation. (IME if the system has the ability to process it?)

If so, please provide a process for manufacturing the first, we'll schedule a meeting to discuss.

結果 (英文) 2:

For the new perforation assessment:
1. We have local suppliers who can grind the process. What is the purpose of the thermal tape you are referring to?
2. In order to reduce the risk on the wafer, we recommend that the process be etched by the via via before being thinized.
3. We currently have less experience with filling through holes, which may also require an assessment of other resources that can be worked together. (Does the IME have the capacity to make this process?)

If you can, please provide a process chart first, we will arrange the meeting to discuss.

結果 (英文) 3:

For new perforation evaluation:
1. We have a local supplier that can carry out grinding process. What is the purpose of the thermal tape you are referring to?
2. In order to reduce the risk of wafer placement, we suggest to etch through via before thinning.
3. At present, we have little experience in filling through holes, which may need to evaluate other resources that can cooperate. Does ime have this process capability
If you can, please provide the process flow chart first, and then we will arrange the meeting for discussion.