9. Silver Conductors - The minimum

9. Silver Conductors - The minimum spacing between any two silver conductors of different potential must not be less than that indicated in Table IB. The silver conductors have been found suitable only for circuits that do not require a dielectric strength potential greater than that indicated between adjacent parts. The maximum voltage applied between any two silver conductors must not exceed that listed in Table IB. Reference to silver conductors infers silver conductors and silver plated conductors, for purposes of this report, unless otherwise indicated. Flame Only boards are not evaluated to determine if silver conductors are present on the board, and the affect of silver conductors on the board shall be considered during the end product evaluation.
10. Other Considerations - The following items shall be considered for insertion into the end-product report:
A. Minimum required spacing between conductors of different potential and between these conductors and dead-metal parts. Cupping, twisting, bowing and/or warping of the board has not been evaluated.
B. Minimum required dielectric/insulation thickness (distance through) between conductor layers has not been evaluated regarding dielectric strength requirements in the end product design.
C. Pattern Limits. The narrowest conductor width shall not be less than the indicated minimum width mid-board or edge conductor depending upon operating temperature and/or ampacity conditions, as indicated in the end product report. Flame Only boards, the minimum width conductors have not been established.
D. Thickness or weight of conductors.
E. Solder limits.
F. The overall board dimensions.
G. Identification marking.
H. For flammability classification, identification of coatings applied by the assembler, end product, or user.


File E314500 Vol. 1 Sec. 1 Page 4 Issued: 2007-11-18
and Report


GENERAL CHARACTERISTICS:

The printed wiring boards must meet the marking, pattern limits, and solder limits given by Engineering Considerations and Table IA and IB.


The overall thickness of the finished board must be equal to or greater than the size indicated in the "Minimum Thickness" column in Table II excluding surface conductors.

The printed wiring boards are fabricated from the base materials shown in Table II, having a solid copper sheet in the minimum thickness shown bonded to one or both sides of the external laminate, unless otherwise indicated. The maximum external board conductor thickness of 102 microns (4 mils) may be used unless otherwise indicated.


DIMENSIONS SHOWN IN TABLE II ARE MINIMUM ACCEPTABLE VALUES.


NOTE - There shall be no changes, additions or substitutions made by the manufacturer in his production, to the information shown in Table II, without prior written clearance from Underwriters Laboratories Inc.

Marking – See Section General.

結果 (中文) 1:

9.银导线-不同潜能任何两个银导体之间的最小间距不必须小于所述表 IB。银导体被发现只适合不需要介电强度潜力大于，表明相邻部件之间的电路。除非另有说明，应用之间任何两个银导体不得超过表磅一定引用到银导体中列出的最大电压会推断出银导线与银镀金的导线，为本报告的目的。火焰唯一议会不评估以确定是否银导体板上存在和最终产品评估过程中应将银导体板上的影响。10.其他注意事项-插入到最终产品报告审议以下项目:A.最低要求不同电位的导体之间和这些导体和死金属零件之间的间距。拔罐、 加捻、 鞠躬或翘曲的董事会尚未评估。B.最低要求导体层间电介质/绝缘厚度 (通过距离) 尚未得到关于介电强度要求在最终产品设计的评价。C.模式限制。最窄的导线宽度不得小于指定的最小宽度中板或边缘导体取决于操作温度和 (或) 载流量的条件下，如最终产品报告所示。火焰只板，不建立了最小宽度导体。D.厚度或重量的导体。E.焊锡限制。F.整个板的尺寸。G.识别标记。H.为易燃性分类、 识别的涂料由汇编程序、 最终产品或用户应用。文件 E314500 卷 1 秒 1 页 4 发布: 2007年-11-18和报告一般特征:印制板必须满足标记、 模式的限制，和焊锡获工程方面考虑和表 IA 和 IB 的限制。成品板的整体厚度必须等于或大于显示的大小在表二所列除外表面导体中的"最小厚度"列。印制的电路板被捏造的由固体铜薄板在显示保税的外部层压板，单面或双面的最小厚度，除非另有说明的表二所示的基础材料。除非另有说明，可以使用 102 微米 (4 密耳) 的最大外部委员会导体厚度。表二所示的尺寸是最小可接受的值。请注意--应没有更改、 添加或替换由制造商在他生产，再到不保险商实验室公司的事先书面批准的情况下表二所示的信息标记 — — 参阅节一般。

結果 (中文) 3:

9。银导体的任何两银导体不同电位之间的最小间距不得小于表磅银导体被发现只适用于电路不需要介电强度潜力大于表示相邻部件之间。最大电压施加任何两银导体之间不得超过表磅到银导体参考上市推断银导体镀银导体，在该报告中，除非另有说明。只有火焰板没有被评估，以确定是否银导体存在于板，在最终产品评价中，应考虑银导体对板的影响。10。其他注意事项-以下项目应考虑插入到最终产品报告：- A的最低要求之间的间距，不同的电位和这些导体之间的金属零件和死亡。拔管，弯曲和/或翘曲的板并没有被评估。B的最小所需的介电/绝缘厚度（通过导体层之间的距离）并没有被评估的介电强度要求的最终产品设计。最窄的导线宽度不应小于指定的最小宽度的中板或边缘导体取决于操作温度和/或载流量的条件下，如在产品端的报告显示。只有火焰板，最小宽度的导线没有被建立。厚度或重量的导体。识别标记。
H.易燃涂料的分类，由汇编程序，用于识别的最终产品，或用户。


文件e314500卷1秒。1页：4发布2007-11-18
和报告


一般特征：

印刷线路板必须符合标记，模式限制，并限制了焊接工程设计和表


IA和IB。